PME 6343-0

Brief

Suggested Prerequisite Courses: Finite Element Methods, Mechanics of Materials This course, Introduction to mechanics of electronic packaging, will give an introduction on conventional and advanced electronic packaging technology, structure design, material characteristics, analysis and predict the mechanical behavior of components under thermal loading.

Description

Course keywords: Electronic packaging, 電子封裝、Thermal and Mechanical Behavior、機械與熱行為、Future Trends、未來趨勢 Syllabus： （1） Introduction to Electronic/MEMS Packages - Functions and requirements of an electronic/MEMS packages - The typical electronic/MEMS packages - Chip, chip carrier, substrate - Material science considerations （2） Electronic/MEMS Packaging architectures （3） Wafer and Chip （4） Chip attachment, wire bonding, wafer bonding, single chip module and MCM （5） Mechanical design, fracture mechanics and finite element for packaging Technologies （6） A brief introduction to Ball Grid Array (BGA)，Flip Chip, Chip Scale and Wafer Level packaging （7） Thermal performance in Electronic/MEMS Packages （8） Prediction of solder joint geometry （9） Reliability Analysis (10） Future Trends of Electronic/MEMS Packaging Technologies Reference books: 1. Donald P. Seraphim, Ronald C. Lasky and Che-Yu Li, "Principles of Electronic Packaging", McGraw-Hill 2. John H. Lau and Yi-Hsin Pao, "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies", McGraw-Hill 3. John H. Lau, "Ball Grid Array Technology", McGraw-Hill 4. John H. Lau, "Flip Chip Technologies", McGraw-Hill 5. Rao R. Tummala, "Fundamentals of Microsystems Packaging", McGraw Hill. 6. John H. Lau, "Chip on Board Technologies for Multichip Modules", Van Nostrand Reinhold (VNR) 7. 江國寧，"微電子系統封裝基礎理論與應用技術". 滄海書局 Two Midterms 50%, Final Exam or Project 40%, Others 10%

Timetable

Scores

Average Percentage 78.8

Std. Deviation 11.91

Remarks

建議先修科目：材料力學、有限單元法或有限單元法導論

Restrictions

Compulsory

Elective

Cross Discipline

First Specialization

Second Specialization