Holiday
GEN III綜三LRA W7W8
This graduate course provides a comprehensive overview on semiconductor advanced IC packages and packaging technologies across application domains of mobile computing, networking, and HPC/AI for engineering graduate students. Students will learn both theory and best practices of advanced packaging technology. After the class learning, students are expected to be familiar with the fundamental aspects of advanced IC packaging technologies and packages in architecture, interconnect technology, materials system, thermal/mechanical/electrical characteristics, and reliability, to further prepare themselves for the future career and research work in semiconductor IC packaging area.
MON | TUE | WED | THU | FRI | |
08:00108:50 | |||||
09:00209:50 | |||||
10:10311:00 | |||||
11:10412:00 | |||||
12:10n13:00 | |||||
13:20514:10 | |||||
14:20615:10 | |||||
15:30716:20 | |||||
16:30817:20 | |||||
17:30918:20 | |||||
18:30a19:20 | |||||
19:30b20:20 | |||||
20:30c21:20 |
Average GPA 3.68
Std. Deviation 0.42
材料部、製程部選修
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