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Holiday
GEN III綜三LRA F2F3F4
This course will focus on “More than Moore” 3D-IC and System-In-Package design, simulation, and sign- off methodology. The goal of this course is to help students understand how to implement a complex electronics system ba<x>sed on intelligent SDA (System Design Automation) technology. Besides, through this course, students can get the essential components of the challenges of latest system level design from all aspects of advanced packaging design and thermal aware electrical analysis.
MON | TUE | WED | THU | FRI | |
| 08:00108:50 | |||||
| 09:00209:50 | |||||
| 10:10311:00 | |||||
| 11:10412:00 | |||||
| 12:10n13:00 | |||||
| 13:20514:10 | |||||
| 14:20615:10 | |||||
| 15:30716:20 | |||||
| 16:30817:20 | |||||
| 17:30918:20 | |||||
| 18:30a19:20 | |||||
| 19:30b20:20 | |||||
| 20:30c21:20 |
Average Percentage 90.73
Std. Deviation 2.79
半導體學院四部選修課程
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