Holiday
GEN III綜三LRB W5W6W7
Semiconductor memories have mainly two uses. One is for the calculation by exchanging data with CPU, MPU, etc. The other is for the mass data storage. Demands for these two applications are following; 1. Low cost and high density, 2. High speed operation, 3. Low power consumption. Therefore, memory technologies have been evolved more than 30 years to satisfy these demands. Moreover, new application has been noticed for the calculation of AI which is called in memory computing. Furthermore, memory device and CPU/MPU are connected chip-to-chip and can get quite high speed and low power operation. I will introduce these new technologies. Following are the outline of the course. Part1: Basic concept of memories: 1. DRAM & SARM 2.NOR-Flash 3. NAND-Flash Part2: 1. 3D NAND, In-memory computing for AI calculation.
Course keywords: Semiconductor memory, data stprage, MOSFET, Capacitor, bit cost Part 1 (Outline of basic concept of semiconductor memories) 1. DRAM & SARM 2. NOR-Flash 3. NAND-Flash Part 2 (Recent device and process technologies of 3D NAND-Flash) Part 3 (Reliability of 3D NAND-Flash) Part 4 (Recent application of solid-state Drive using 3D-NAND) Part 5 (Issues of recent DRAM and its new technology trend) Part 6 (New application of memory: in memory computing for AI) Part 7 (Recent technology for high band width and low power)
MON | TUE | WED | THU | FRI | |
08:00108:50 | |||||
09:00209:50 | |||||
10:10311:00 | |||||
11:10412:00 | |||||
12:10n13:00 | |||||
13:20514:10 | |||||
14:20615:10 | |||||
15:30716:20 | |||||
16:30817:20 | |||||
17:30918:20 | |||||
18:30a19:20 | |||||
19:30b20:20 | |||||
20:30c21:20 |
Average Percentage 84.5
Std. Deviation 8.67
元件部選修
-
-
-
-