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Holiday
GEN III綜三LRA W7W8
This graduate course aims to provide a comprehensive overview of semiconductor advanced IC packages and packaging technologies across application domains of mobile/5G, networking and AI/high performance computing for engineering graduate credentials. Students are expected to learn the fundamentals of advanced IC packaging technologies and packages to prepare themselves for the future career and research work in the area of semiconductor advanced IC chiplets system integration.
MON | TUE | WED | THU | FRI | |
08:00108:50 | |||||
09:00209:50 | |||||
10:10311:00 | |||||
11:10412:00 | |||||
12:10n13:00 | |||||
13:20514:10 | |||||
14:20615:10 | |||||
15:30716:20 | |||||
16:30817:20 | |||||
17:30918:20 | |||||
18:30a19:20 | |||||
19:30b20:20 | |||||
20:30c21:20 |
Average GPA 4.04
Std. Deviation 0.33
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