NEMS 5201-0

Brief

以半導體元件封裝為基礎，進行微機電元件的封裝製程設計教授。從封裝模組的選擇，電性，散熱及機械強度的考量下，設計出最佳的元件封裝 製作方式。後半部將以元件及模組的可靠度分析與實證教授為主，進行可靠性及品管分析。

Description

Course keywords: 微機電封裝(MEMS packaging)，可靠度(Reliability)，晶片封裝(Chip packaging)，封裝設計(Packaging Design)，多晶片封裝(Multi-chips packaging)。 一、課程說明(Course Description) 二、指定用書(Text Books) 1.“Fundamentals of Microsystems Packaging”, Rao R. Tummala, McGraw-Hill, 2001 2. Note files will be given at lecture. 三、參考書籍(References) 1.“Electronic packaging: design, materials, process, and reliability”, John Lau, C.P. Wong, John L. Prince, and Wataru Nakayama, McGraw Hill, 1998. 2.“Semiconductor Packaging: a multidisciplinary approach”, Robert J. Hannemann, Allan D. Kraus, and Michael Pecht, Wiley Interscience, 1994. 3.“微系統封裝原理與技術”, 邱碧秀著, 滄海書局, 2005. 4.“Area Array Packaging Handbook”, Ken Gilleo, Editor, McGraw-Hill, 2002. 5.“Advanced Electronic Packaging with emphasis on multichip modules”, William D. Brown, IEEE- Press, 1999. 四、教學方式(Teaching Method) Lecture: 3 hours per week. (Every Tuesday 9-12 AM) 五、教學進度(Syllabus) 課程內容: 1.Introduction to MEMS 2.Traditional microelectronic packaging and MEMS packaging 3.Die Attach/Chip Bond, Chip level interconnections, and Solder bonding 4.MEMS release technique 5.Multi-chip Module(MCM), Chip scale packaging, and Array packaging 6. ANSYS simulation tool 7.Electronic design, analysis of packaging 8.Thermal design, analysis of packaging 9.Array packaging and other MEMS packaging 10.Mechanical design, analysis of packaging Midterm exam 11.MEMS reliability issue 12.Failure mechanisms and mechanical design for reliability 13.Failure analysis and case study Term project presentation 六、成績考核(Evaluation) Grades: Homework 20%, Midterm 30%, Term project (report and presentation)50% 七、可連結之網頁位址

Timetable

Scores

Average Percentage 77.69

Std. Deviation 21.68

Remarks

Restrictions

Compulsory

Elective

Cross Discipline

First Specialization

Second Specialization